OptEM Inspector Training - Sample Outline

Typical Day 1|Typical Day 2

Typical Day 1

Overview of OptEM Inspector
  • installation directories and files
  • programs bundled with OptEM Inspector (Helios and Spock interfaces)
  • layout-to-circuit extraction flow
  • layout extraction output (active components, 2-d and 3-d RC interconnect, 2-d and 3-d RC substrate coupling)
  • circuit retrieval output (SPICE, HSPICE, SPF, SPEF, VHDL)
  • output desktop directories and files
Basic Extractions
  • introduction of technology files
  • recognizing transistors, MOSFETs and BJTs
  • extraction flow and method using scanline technique
  • network reduction heuristics, CPU and memory requirements
  • Helios interface for layout-to-circuit extraction
  • perform hierarchical and flat extractions of active components (basic extraction)
  • retrieve Spice circuits (netlists) for hierarchical and flat extractions
Numerical Techniques
  • from Maxwell's equations to transmission line equations
  • static, electric and magnetic fields
  • TEM including quasi-stationary and full wave approach
  • numerical methods of solving differential equations (FDM and FEM)
  • numerical methods of solving integral equations including: charge simulation technique, multipole expansion, method of images and boundary element method (BEM)
  • meshing techniques used by OptEM software
  • eddy currents, and skin and proximity effects
Building Technology Files
  • introducing a new process and editing existing processes
  • process file descriptions and details
  • Spock interface and the tab sheets used for building technology files
  • spreadsheet data-entry environment
  • condition lists for active device recognition
  • saving and generating process files
  • compiling the process files in Helios in preparation for extraction
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Typical Day 2

Modeling the Substrate
  • empirical parametric method for substrate resistance
  • boundary element method for substrate resistance extraction
  • practical BEM based modeling
  • extension for layout-dependent doping profiles in the substrate
  • substrate modeling using a combined BEM/FEM technique
  • frequency dependent substrate modeling
Substrate Extractions
  • hierarchical 3-d substrate extraction using different extraction window sizes
  • compare Spice circuits for different extraction window sizes to see effect on direct R coupling in the substrate
  • show active drawing of boundary element mesh during 3-d substrate R extraction
  • add an extra substrate contact using the layout editor, re-extract and compare Spice circuits
RC Extractions
  • capacitance extraction using partial components: parallel plate, lateral and edge
  • 2-d interconnect RC extractions
  • 3-d interconnect C extractions
  • flat and hierarchical extraction using different extraction window size
  • retrieve and compare Spice netlists
  • show active drawing of finite element mesh during extractions

To obtain a quotation or discuss further details about the seminar, please fill out ourform. Alternatively, please emailOptEMor call us at +1(403)289-0499.

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