Technical Papers

Cable Modeling & Design|Submicron IC Extraction

Technical papers with links to abstracts are listed here for cable system and submicron IC extraction topics. To obtain a copy of any of these papers, please make a note of the reference number and fill out ourrequest form.

Cable Modeling & Design

Impact of Cable Length on NEXT

Reference Number: C24-IWCS2018 (Seeabstract)

Authors: J. Poltz

Presented at the 67th IWCS Conference/International Cable & Connectivity Symposium, October 14-17, 2018, Providence, RI, USA

Attenuation of Screened Twisted Pairs

Reference Number: C23-IWCS2017 (Seeabstract)

Authors: J. Poltz

Presented at the 66th IWCS Conference/International Cable & Connectivity Symposium, October 8-11, 2017, Orlando, FL, USA

Advances in Virtual Prototyping of Data Cables

Reference Number: C22-IWCS-China2017 (Seeabstract)

Authors: J. Poltz

Presented at the 1st UL and IWCS China 2017 Cable & Connectivity Symposium, April 25-27, 2017, Shanghai, China

NEXT Between Screened Twisted Pairs

Reference Number: C21-IWCS2016 (Seeabstract)

Authors: J. Poltz

Presented at the 65th IWCS Conference/International Cable Connectivity Symposium, October 2-5, 2016, Providence, RI, USA

Impact of Quad Cable Manufacturing Tolerances on NEXT

Reference Number: C20-IWCS2015 (Seeabstract)

Authors: J. Poltz and J. Domingue

Presented at the 64th IWCS Conference/International Cable Connectivity Symposium, October 6-8, 2015, Atlanta, GA, USA

Near End Crosstalk in Quad Cables

Reference Number: C19-IWCS2014 (Seeabstract)

Authors: J. Poltz and J. Domingue

Presented at the 63rd IWCS/Focus Conference, November 10-12, 2014, Providence, RI, USA

Impact of Manufacturing Tolerances on Cable Design Optimization

Reference Number: C18-IWCS2013 (Seeabstract)

Authors: J. Poltz and M. Josefsson

Presented at the 62nd IWCS/Focus Conference, November 10-13, 2013, Charlotte, NC, USA

Optimizing Shielded Pair Manufacturing

Best Paper Award

Reference Number: C17-Interwire2013 (Seeabstract)

Authors: J. Poltz and M. Josefsson

Presented at the Interwire Trade Exposition, 83rd WAI Annual Convention, April 23-25, 2013, Atlanta, GA, USA

Sensitivity Analysis of Shielded Cables

Reference Number: C16-IWCS2012 (Seeabstract)

Authors: J. Poltz and M. Josefsson

Presented at the 61st IWCS/Focus Conference, November 12-14, 2012, Providence, RI, USA

Measurement & Modeling of Insertion Loss in Cables with Helical Screens

Reference Number: C15-IWCS2011 (Seeabstract)

Authors: M. Josefsson and J. Poltz

Presented at the 60th IWCS/Focus Conference, November 7-9, 2011, Charlotte, NC, USA

Unbalance & Mode Transfer in Shielded Pairs

Reference Number: C14-IWCS2010 (Seeabstract)

Authors: M. Josefsson and J. Poltz

Presented at the 59th IWCS/Focus Conference, November 8-10, 2010, Providence, RI, USA

Measurement & Simulation of Unbalances in Symmetrical Transmission Lines

Reference Number: C13-IWCS2009 (Seeabstract)

Authors: J. Poltz and M. Josefsson

Presented at the 58th IWCS/Focus Conference, November 8-11, 2009, Charlotte, NC, USA

Return Loss Decay at High Frequencies

Reference Number: C12-IWCS2008 (Seeabstract)

Authors: M. Josefsson and J. Poltz

Presented at the 57th IWCS/Focus Conference, November 9-12, 2008, Providence, RI, USA

Impact of Connectors on NEXT in Twisted Pair Cables

Reference Number: C11-IWCS2007 (Seeabstract)

Authors: J. Poltz and M. Josefsson

Presented at the 56th IWCS/Focus Conference, November 11-14, 2007, Lake Buena Vista, FL, USA

Measurement & Simulation of Differential Skew in Twisted Pair Cables

Reference Number: C10-IWCS2006 (Seeabstract)

Authors: J. Poltz, J. Beckett and M. Josefsson

Presented at the 55th IWCS/Focus Conference, November 13-16, 2006, Providence, RI, USA

Predicting High Crosstalk Frequencies in Twisted Pair Cables

Reference Number: C09-EMC2006 (Seeabstract)

Authors: J. Poltz and J. Beckett

Presented at EMC Europe, September 4-8, 2006, Barcelona, Spain

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Submicron IC Extraction

Efficient Sensitivity-Based Capacitance Modeling for Systematic and Random Geometric Variations

Reference Number: I03-ASPDAC2011 (Seeabstract)

Authors: Y. Bi, P. Harpe, and N.P. van der Meijs

Presented at the 16th Asia & South Pacific Design Automation Conference, January 25-28, 2011, Yokohama, Japan

Combined BEM/FEM Resistance Modeling of Stratified Substrates With Layout-Dependent Doping Patterns in the Top Layer

Reference Number: I02-WP2005 (Seeabstract)

Authors: E. Schrik, A.J. van Genderen, and N.P. van der Meijs

Discussion paper, 2005, Delft, The Netherlands

Modeling Capacitive Coupling Effects Via the Substrate

Reference Number: I01-WP2005 (Seeabstract)

Authors: A.J. van Genderen, N.P. van der Meijs, and E. Schrik

Discussion paper, 2005, Delft, The Netherlands

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